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Laser Depaneling Machine

Laser Depaneling Machine

  • Product description: Laser Depaneling Machine
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Laser Depaneling Machine

Laser Depaneling of Printed Circuit Boards (PCBs) for Stress-free Cutting

 

This systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.

Process advantages

Compared to conventional tools, laser processing offers a compelling series of advantages.

  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
  • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

 

Processing Flat Substrates

UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs with every new product layout. It is optimized for these work steps.
 

  • Complex contours
  • No substrate brackets or cutting tools
  • More panels on the base material
  • Perforations and decaps


 

Integration in MES Solutions

The model seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.

 

Laser class 1
Max. working area (X x Y x Z) 460 mm x 460 mm x 11 mm
 
Max. recognition area (X x Y) 460 mm x 460 mm
Max. material size (X x Y) 350 mm x 350 mm
Data input formats Gerber, X-Gerber, DXF, HPGL,
Max. structuring speed Depends on application
Positioning accuracy ± 25 μm (1 Mil)
Diameter of focused laser beam 20 μm (0.8 Mil)
Laser wavelength 355 nm
System dimensions (W x H x D) 1000mm*940mm
*1520 mm
Weight ~ 1500 kg (990 lbs)
Operating conditions  
Power supply 230 VAC, 50-60 Hz, 3 kVA
Cooling Air-cooled (internal water-air cooling)
Ambient temperature 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
Humidity < 60 % (non-condensing)
Required accessoires Exhaust unit

CONTACT US

Contact: Amy Lee

Phone: /Wechat/Whatapp: + 86 136 8490 4990

Tel: 86-755-33581320/+8613829839112

Email: s6@smtfly.com /s4@smtfly.com

Add: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103