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Laser PCB Separator Machine

Laser PCB Separator Machine

  • Product description: Laser PCB Separator Machine
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Laser PCB Separator Machine, CWVC-5L


Laser Depaneling of Printed Circuit Boards (PCBs) for Stress-free Cutting

This systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.

 

Process advantages

Compared to conventional tools, laser processing offers a compelling series of advantages.

  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
  • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

 

Processing Flat Substrates

UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs with every new product layout. It is optimized for these work steps.

  • Complex contours
  • No substrate brackets or cutting tools
  • More panels on the base material
  • Perforations and decaps


 

Integration in MES Solutions

The model seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.


Specification

Laser
Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength 355nm
Laser Power 10W/12W/15W/18W@30KHz
Positioning Precision of Worktable of Linear Motor ±2μm
Repetition Precision of Worktable of Linear Motor ±1μm
Effective Working Field 400mmX300mm(Customizable)
Laser Scanning Speed 2500mm/s (max)
Galvanometer Working Field Per One Process 40mmх40mm

 



CONTACT US

Contact: Lisa

Phone: /Wechat/Whatapp: + 86 13510221120

Tel: 86-755-33583456

Email: sales@smtfly.com

Add: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103