Home > Mobile Phone

  • UV Laser Depaneling
UV Laser Depaneling

UV Laser Depaneling

  • Product description: UV Laser Depaneling
  • INQUIRY

UV Laser Depaneling, CWVC-5L

Specification:

Laser class 1
Max. working area (X x Y x Z) 300 mm x 300 mm x 11 mm
Max. recognition area (X x Y) 300 mm x 300 mm
Max. material size (X x Y) 350 mm x 350 mm
Data input formats Gerber, X-Gerber, DXF, HPGL,
Max. structuring speed Depends on application
Positioning accuracy ± 25 μm (1 Mil)
Diameter of focused laser beam 20 μm (0.8 Mil)
Laser wavelength 355 nm
System dimensions (W x H x D) 1000mm*940mm
*1520 mm
Weight ~ 450 kg (990 lbs)
Operating conditions  
Power supply 230 VAC, 50-60 Hz, 3 kVA
Cooling Air-cooled (internal water-air cooling)
Ambient temperature 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
Humidity < 60 % (non-condensing)
Required accessoires Exhaust unit
 
Working principle : 
 
humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters 
 ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance
spring ( general balance spring with alloy )
 
 
Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

CONTACT US

Contact: Amy Lee

Phone: /Wechat/Whatapp: + 86 136 8490 4990

Tel: 86-755-33581320/+8613829839112

Email: s6@smtfly.com /s4@smtfly.com

Add: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103