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Laser PCB Depaneling Machine

Laser PCB Depaneling Machine

  • Product description: Laser PCB Depaneling Machine
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Laser PCB Depaneling Machine, CWVC-5L

The demand for small, hand-held electronics with more features is driving smaller, thinner, and more dense flex and rigid printed circuit boards (PCBs).

Depaneling, or the laser singulation of printed circuit boards, offers numerous advantages to a traditional bit router or mechanical saw, including:

  • Non-contact cutting process to eliminate stress to the PCB and its delicate components
  • Reduced micro-cracks and reduced delamination for longer PCB life
  • Greater flexibility to cut unusual shapes
  • Faster set up for smaller production batches
  • More consistent laser accuracy over the life of the tool
  • Narrower cuts and less dust generated during the laser singulation process
  • Fewer burrs

Specification

Laser Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength 355nm
Laser Power 10W/12W/15W/18W@30KHz
Positioning Precision of Worktable of Linear Motor ±2μm
Repetition Precision of Worktable of Linear Motor ±1μm
Effective Working Field 400mmX300mm(Customizable)
Laser Scanning Speed 2500mm/s (max)
Galvanometer Working Field Per One Process 40mmх40mm

 

High Effective Laser Source

355nm Laser Depaneling Machine Printed Circuit Board UV Cutting Machine  355nm Laser Depaneling Machine Printed Circuit Board UV Cutting Machine

 

CONTACT US

Contact: Amy Lee

Phone: /Wechat/Whatapp: + 86 136 8490 4990

Tel: 86-755-33581320/+8613829839112

Email: s6@smtfly.com /s4@smtfly.com

Add: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103